kamkar
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Yes just to demo that they can solder the heat spreader on those like i suggest Zenfox do with the heat sink and EMI shield instead of glue.
Or they can use a regular thermal paste between CPU die and heat spreader, as i recall thermal paste CPU's are rumored to perform better thermal than soldered ones. though no one have compared the 2 types of interface head 2 head as no CPU come with both kind of assembly.
I have also been wondering why no one make a water cooling head that would go on a de-lidded CPU and then cool directly on the CPU dies and not have any copper in between like a conventional H2O cooler.
Had that idea ever since my first Athlon CPU which back then dident have a heat spreader.
Of course you would have to waterproof components around the CPU die / dies, but the dies them self i think are sealed around the edge so water in this case cant get in under the die.
This i think they already do when cooling with liquid gasses for maximum overclock, though they do still use a copper "head" for the liquid gas itself, the CPU and even much of the motherboard prep are more for condensation problems.
Or they can use a regular thermal paste between CPU die and heat spreader, as i recall thermal paste CPU's are rumored to perform better thermal than soldered ones. though no one have compared the 2 types of interface head 2 head as no CPU come with both kind of assembly.
I have also been wondering why no one make a water cooling head that would go on a de-lidded CPU and then cool directly on the CPU dies and not have any copper in between like a conventional H2O cooler.
Had that idea ever since my first Athlon CPU which back then dident have a heat spreader.
Of course you would have to waterproof components around the CPU die / dies, but the dies them self i think are sealed around the edge so water in this case cant get in under the die.
This i think they already do when cooling with liquid gasses for maximum overclock, though they do still use a copper "head" for the liquid gas itself, the CPU and even much of the motherboard prep are more for condensation problems.